Invention Grant
- Patent Title: Micro-electro-mechanical system (MEMS) thermal sensor
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Application No.: US17216047Application Date: 2021-03-29
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Publication No.: US11796396B2Publication Date: 2023-10-24
- Inventor: Tsai-Hao Hung , Shih-Chi Kuo
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- The original application number of the division: US16408769 2019.05.10
- Main IPC: B81B5/00
- IPC: B81B5/00 ; G01K7/32 ; B81B3/00 ; B81C1/00

Abstract:
The structure of a micro-electro-mechanical system (MEMS) thermal sensor and a method of fabricating the MEMS thermal sensor are disclosed. A method of fabricating a MEMS thermal sensor includes forming first and second sensing electrodes with first and second electrode fingers, respectively, on a substrate and forming a patterned layer with a rectangular cross-section between a pair of the first electrode fingers. The first and second electrode fingers are formed in an interdigitated configuration and suspended above the substrate. The method further includes modifying the patterned layer to have a curved cross-section between the pair of the first electrode fingers, forming a curved sensing element on the modified patterned layer to couple to the pair of the first electrodes, and removing the modified patterned layer.
Public/Granted literature
- US20210215550A1 MICRO-ELECTRO-MECHANICAL SYTEM (MEMS) THERMAL SENSOR Public/Granted day:2021-07-15
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