Invention Grant
- Patent Title: Method for isolating a conductive via from a glass substrate
-
Application No.: US17333373Application Date: 2021-05-28
-
Publication No.: US11798816B2Publication Date: 2023-10-24
- Inventor: Omar Saad Ahmed , Tengfei Jiang
- Applicant: University of Central Florida Research Foundation, Inc.
- Applicant Address: US FL Orlando
- Assignee: University of Central Florida Research Foundation, Inc.
- Current Assignee: University of Central Florida Research Foundation, Inc.
- Current Assignee Address: US FL Orlando
- Agency: Fogg & Powers LLC
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/66 ; H01L23/15 ; H01L23/498
Abstract:
A method for isolating at least one conductive via from a surrounding glass substrate is provided. A support layer is formed over at least one surface of the glass substrate. Thereafter, the glass substrate is removed. As a result, the at least one conductive via can be analyzed without interference from the glass substrate.
Public/Granted literature
- US20210407820A1 METHOD FOR ISOLATING A CONDUCTIVE VIA FROM A GLASS SUBSTRATE Public/Granted day:2021-12-30
Information query
IPC分类:
