A Chip on Film (COF) package and a display device including the same are provided. The COF package includes: a film substrate; a chip arranged within a chip region on the film substrate; outer leads; and inner leads. The outer leads are arranged on the same side of the chip region and arranged as at least two rows of outer leads. The inner leads are arranged on a first side and a second side of the chip and connected with the chip. The at least two rows of outer leads include a first row and a second row of outer leads, the first row of outer leads are between the second row of outer leads and the chip, and wirings between at least part of leads among the second row of outer leads and the inner leads on the second side of the chip adopt a closed-loop like connection mode.