A chip packaging structure and a method for preparing the same are disclosed. The method includes: providing a wafer having a first surface and a second surface, forming a first redistribution layer on the first surface, wherein the wafer includes TSVs having first ends exposed from the wafer; forming welding pads electrically connected to the TSVs through the first redistribution layer; forming a trimming groove in an edge area of the wafer; bonding the first surface of the wafer to a first supporting substrate, and thinning the second surface of the wafer to expose the second ends of the TSVs; forming, on the second surface of the wafer, solder balls electrically connected to the TSVs through a second redistribution layer; bonding the second surface of the wafer to a second supporting substrate, and peeling off the first supporting substrate; and connecting the welding pads to a semiconductor chip.