Invention Grant
- Patent Title: Module structure and electronic apparatus
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Application No.: US17384511Application Date: 2021-07-23
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Publication No.: US11798930B2Publication Date: 2023-10-24
- Inventor: Jiandong Huang
- Applicant: Shanghai Harvest Intelligence Technology Co., Ltd.
- Applicant Address: CN Shanghai
- Assignee: Shanghai Harvest Intelligence Technology Co., Ltd.
- Current Assignee: Shanghai Harvest Intelligence Technology Co., Ltd.
- Current Assignee Address: CN Shanghai
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN 2010727713.3 2020.07.24 CN 2021495266.5 2020.07.24
- Main IPC: H01L25/18
- IPC: H01L25/18 ; G06V40/13 ; H10K50/854

Abstract:
The present disclosure provides a module structure and an electronic apparatus. The module structure includes: a sensing component, a sensing surface and a display component disposed between the sensing component and the sensing surface; an air layer disposed between the display component and the sensing component; and a scattering layer disposed between the air layer and the display component; wherein light generated by the display component is reflected or refracted on the sensing surface to form signal light carrying an information, and the signal light is transmitted through the scattering layer and the air layer and received by the sensing component. The present disclosure can realize decoupling between the sensing component and the display component, reduce the influence of a bonding stress on a display effect of the display component, and avoid the influence of the air layer on the realization of the function of the sensing component.
Public/Granted literature
- US20220028849A1 Module Structure and Electronic Apparatus Public/Granted day:2022-01-27
Information query
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