Invention Grant
- Patent Title: Flexible printed circuit board and battery module
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Application No.: US17152445Application Date: 2021-01-19
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Publication No.: US11799164B2Publication Date: 2023-10-24
- Inventor: Shunsuke Tomita , Tomoki Kanayama , Kazuyuki Azuma
- Applicant: NIPPON MEKTRON, LTD.
- Applicant Address: JP Tokyo
- Assignee: NIPPON MEKTRON, LTD.
- Current Assignee: NIPPON MEKTRON, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP 20019139 2020.02.06
- Main IPC: H01M50/284
- IPC: H01M50/284 ; H01M50/507 ; H01M50/519

Abstract:
A flexible printed circuit board which includes: a base film; and multiple wires formed on the base film, in which in a region attached to a battery including multiple arrayed cells, a conductor portion to be the multiple wires is provided only on one surface of the base film, at at least part of a region apart from the region attached to the battery, a conductor portion to be the multiple wires is provided on each surface of the base film, and the flexible printed circuit board further includes multiple conductive portions configured to electrically connect the wires on one surface side of the base film and the wires on the other surface side of the base film.
Public/Granted literature
- US20210249727A1 FLEXIBLE PRINTED CIRCUIT BOARD AND BATTERY MODULE Public/Granted day:2021-08-12
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