Invention Grant
- Patent Title: Sound producing device and method of manufacturing sound producing device
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Application No.: US16784792Application Date: 2020-02-07
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Publication No.: US11800292B2Publication Date: 2023-10-24
- Inventor: Ryo Inoue , Tadashi Hanai , Satoru Fujiwara
- Applicant: HOSIDEN CORPORATION
- Applicant Address: JP Osaka
- Assignee: HOSIDEN CORPORATION
- Current Assignee: HOSIDEN CORPORATION
- Current Assignee Address: JP Osaka
- Agency: GREENBLUM & BERNSTEIN, P.L.C.
- Priority: JP 19026469 2019.02.18
- Main IPC: H04R17/00
- IPC: H04R17/00 ; H01L41/187 ; H01L41/313 ; H10N30/073 ; H10N30/853

Abstract:
A sound producing device in which an adhesive layer between a piezoelectric element and a metal plate has sufficient electrical conductivity includes: a metal plate; a piezoelectric ceramic including a first adhesion surface, the first adhesion surface being a surface bonded to the metal plate; an alternating current power supply that applies an alternating voltage to the piezoelectric ceramic; and an adhesive layer formed from conductive adhesive and thermosetting adhesive which are spread over the first adhesion surface, the conductive adhesive being applied in a center portion of the first adhesion surface and the thermosetting adhesive being applied at three or more locations in a periphery of the first adhesion surface. An adhesion surface of the metal plate that is bonded to the piezoelectric ceramic is a second adhesion surface, and the first adhesion surface and the second adhesion surface are bonded together by the adhesive layer.
Public/Granted literature
- US20200267477A1 SOUND PRODUCING DEVICE AND METHOD OF MANUFACTURING SOUND PRODUCING DEVICE Public/Granted day:2020-08-20
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