Invention Grant
- Patent Title: Raised pathway heat sink
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Application No.: US17400309Application Date: 2021-08-12
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Publication No.: US11800685B2Publication Date: 2023-10-24
- Inventor: Justin Diep , Chien-Cheng Huang , John Hausman , Hai Lin
- Applicant: ARRIS Enterprises LLC
- Applicant Address: US GA Suwanee
- Assignee: ARRIS Enterprises LLC
- Current Assignee: ARRIS Enterprises LLC
- Current Assignee Address: US GA Suwanee
- Agency: Panitch Schwarze Belisario & Nadel LLC
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02 ; H05K9/00 ; H05K1/18 ; H05K7/14 ; H01Q1/12

Abstract:
Wireless electronic devices include one or more wireless antennas to provide for wireless communications. The antenna cables are routed internally within the device and typically noise from components located on a circuit board may couple to the antenna cables and cause a degradation in wireless performance, impact antenna sensitivity and cause packet loss. Utilizing raised pathways in a heat sink utilized for thermal transfer of heat to a housing enables tunnels to be formed between the housing and the heat sink. Routing the antenna cables through the tunnels improves noise isolation for the antenna cables while still maintaining the heat transfer. The raised pathways are configured to not interfere with components on the circuit board or components included in the housing. The wireless antennas may be mounted within the housing instead of on the board so no portion of the antenna cables are located on the circuit board.
Public/Granted literature
- US20210378134A1 RAISED PATHWAY HEAT SINK Public/Granted day:2021-12-02
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