Invention Grant
- Patent Title: Nip formation pad, heating device, fixing device, and image forming apparatus
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Application No.: US17580703Application Date: 2022-01-21
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Publication No.: US11803143B2Publication Date: 2023-10-31
- Inventor: Yoshiki Yamaguchi , Ippei Fujimoto , Takashi Seto , Hiroshi Yoshinaga , Kentaro Yamashita
- Applicant: Yoshiki Yamaguchi , Ippei Fujimoto , Takashi Seto , Hiroshi Yoshinaga , Kentaro Yamashita
- Applicant Address: JP Kanagawa
- Assignee: RICOH COMPANY, LTD.
- Current Assignee: RICOH COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: XSENSUS LLP
- Priority: JP 21040421 2021.03.12
- Main IPC: G03G15/20
- IPC: G03G15/20
Abstract:
A nip formation pad includes a base, a high thermal conduction member, and an attachment. The high thermal conduction member has a thermal conductivity greater than a thermal conductivity of the base. The attachment is attached to the high thermal conduction member by elastic deformation of the attachment on the base held between the high thermal conduction member and the attachment.
Public/Granted literature
- US20220291613A1 NIP FORMATION PAD, HEATING DEVICE, FIXING DEVICE, AND IMAGE FORMING APPARATUS Public/Granted day:2022-09-15
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