Invention Grant
- Patent Title: Output structure for power supply with a plurality of heat dissipation plates
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Application No.: US17587100Application Date: 2022-01-28
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Publication No.: US11803218B2Publication Date: 2023-10-31
- Inventor: Hung-Wei Yang , Chih-Sheng Chang
- Applicant: SEA SONIC ELECTRONICS CO., LTD.
- Applicant Address: TW Taipei
- Assignee: SEA SONIC ELECTRONICS CO., LTD.
- Current Assignee: SEA SONIC ELECTRONICS CO., LTD.
- Current Assignee Address: TW Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20 ; G06F1/18

Abstract:
The invention provides an output structure for a power supply, comprising a working circuit board, an output circuit board, a plurality of output connectors, a plurality of heat dissipation plates and a plurality of thermistors. The output circuit board is electrically connected with the working circuit board and is provided with at least one temperature sensing circuit, the plurality of output connectors is arranged on the output circuit board, the plurality of heat dissipation plates is arranged on the output circuit board and close to the output connectors, the plurality of heat dissipation plates senses heat of the output circuit board and at least one of the output connectors at the same time, the plurality of thermistors is arranged corresponding to the plurality of heat dissipation plates one to one and is connected with the at least one temperature sensing circuit.
Public/Granted literature
- US20230244286A1 OUTPUT STRUCTURE FOR POWER SUPPLY Public/Granted day:2023-08-03
Information query