Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US17184792Application Date: 2021-02-25
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Publication No.: US11804400B2Publication Date: 2023-10-31
- Inventor: Mitsuaki Sato
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP 20039925 2020.03.09
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01J37/32

Abstract:
A substrate processing apparatus that includes a chamber, a substrate support disposed in the chamber, and a connection is provided. The chamber is provided with a bottom including a first flow path, and the substrate support includes a second flow path. The connection connects the first flow path to the second flow path, and the connection includes a sleeve through which the first flow path is in fluid communication with the second flow path, and a core including a first rod segment and a first elastic foam segment. The core is disposed in the sleeve, and a gap is defined between an inner surface of the sleeve and a side surface of the first rod segment.
Public/Granted literature
- US20210280450A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2021-09-09
Information query
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