Invention Grant
- Patent Title: Solid-state imaging device and electronic apparatus
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Application No.: US17533560Application Date: 2021-11-23
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Publication No.: US11804507B2Publication Date: 2023-10-31
- Inventor: Ikue Mitsuhashi , Reijiroh Shohji , Minoru Ishida , Tadashi Iijima , Takatoshi Kameshima , Hideto Hashiguchi , Hiroshi Horikoshi , Masaki Haneda
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: CHIP LAW GROUP
- Priority: JP 17074808 2017.04.04 JP 17157400 2017.08.17
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L23/00

Abstract:
A solid-state imaging device including a first substrate having a pixel unit formed thereon and including a first semiconductor substrate and a first multi-layered wiring layer stacked, a second substrate having a circuit formed thereon and including a second semiconductor substrate and a second multi-layered wiring layer, the circuit having a predetermined function, and a third substrate having a circuit formed thereon and including a third semiconductor substrate and a third multi-layered wiring layer. The first substrate and the second substrate are bonded together such that that the first multi-layered wiring layer and the second semiconductor substrate are opposed to each other. The solid-state imaging device includes a first coupling structure and a second coupling structure. The first coupling structure electrically couples a circuit of the first substrate and the circuit of the second substrate.
Public/Granted literature
- US20220085093A1 SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS Public/Granted day:2022-03-17
Information query
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