Invention Grant
- Patent Title: Semiconductor structure and method for forming the same
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Application No.: US17716976Application Date: 2022-04-08
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Publication No.: US11804548B2Publication Date: 2023-10-31
- Inventor: Yuan-Sheng Huang , Ryan Chia-Jen Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT LAW
- Agent Anthony King
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/8234 ; H01L29/66 ; H01L29/417

Abstract:
A semiconductor structure is provided. The semiconductor structure includes fin structures, a gate structure across the fin structures, and a dielectric layer. The gate structure includes a work function layer over the gate dielectric layer, and a contact layer over the work function layer. A portion of the work function layer is located between the fin structures, and a top surface of the portion is higher than a top surface of the fin structures. A top surface of the work function layer and a top surface of the dielectric layer are substantially on a same level. A method for forming a semiconductor structure is also provided.
Public/Granted literature
- US20220238708A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2022-07-28
Information query
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