Invention Grant
- Patent Title: Board-to-board connector assembly for add-in cards
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Application No.: US17383044Application Date: 2021-07-22
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Publication No.: US11804667B2Publication Date: 2023-10-31
- Inventor: Randall Robert Henry , Michael John Phillips , Michael David Herring , Brandon Michael Matthews
- Applicant: TE Connectivity Services GmbH
- Applicant Address: CH Schaffhausen
- Assignee: TE CONNECTIVITY SOLUTIONS GmbH
- Current Assignee: TE CONNECTIVITY SOLUTIONS GmbH
- Current Assignee Address: CH Schaffhausen
- Main IPC: H01R12/72
- IPC: H01R12/72 ; H01R12/70 ; H01R12/73 ; H01R13/629 ; H01R13/502 ; H01R13/627 ; H01R12/78

Abstract:
A board-to-board connector assembly includes first and second connector assemblies and a connector interconnect between the first and second connector assemblies. Each connector assembly includes an outer shell and a connector received in a cavity of the outer shell. The connector has a connector body holding contacts in a card slot, which receives a circuit card edge of an add-in card. The outer shell has an outer board guide configured to engage the add-in card and guide mating of the outer shell with the add-in card. The outer shell has a latch configured to latchably engage the add-in card to secure the connector to the add-in card. The connector interposer electrically interconnects the contacts of the connector assemblies to electrically connect the add-in cards.
Public/Granted literature
- US20230025918A1 BOARD-TO-BOARD CONNECTOR ASSEMBLY FOR ADD-IN CARDS Public/Granted day:2023-01-26
Information query