- Patent Title: Sound producing package structure and manufacturing method thereof
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Application No.: US17348773Application Date: 2021-06-16
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Publication No.: US11805342B2Publication Date: 2023-10-31
- Inventor: Chiung C. Lo , Hsien-Ken Liao , Martin George Lim
- Applicant: xMEMS Labs, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: xMEMS Labs, Inc.
- Current Assignee: xMEMS Labs, Inc.
- Current Assignee Address: US CA Santa Clara
- Agent Winston Hsu
- Main IPC: H04R1/02
- IPC: H04R1/02 ; H04R3/00 ; H04R31/00 ; H04R7/04
Abstract:
A sound producing package structure includes a shell and a chip. The shell includes a top structure, a bottom structure and a sidewall structure. The chip is disposed inside the shell and configured to produce an acoustic wave, wherein the chip includes a thin film structure and an actuator configured to actuate the thin film structure, and the thin film structure is substantially parallel to the top structure and the bottom structure. A first opening is formed on the sidewall structure, and the acoustic wave propagates outwards through the first opening.
Public/Granted literature
- US20210314688A1 SOUND PRODUCING PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-10-07
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