Invention Grant
- Patent Title: Liquid metal circuits and methods of making the same
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Application No.: US16817176Application Date: 2020-03-12
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Publication No.: US11805597B2Publication Date: 2023-10-31
- Inventor: O Burak Ozdoganlar , Carmel Majidi , Kadri Bugra Ozutemiz , James Wissman
- Applicant: Carnegie Mellon University
- Applicant Address: US PA Pittsburgh
- Assignee: CARNEGIE MELLON UNIVERSITY
- Current Assignee: CARNEGIE MELLON UNIVERSITY
- Current Assignee Address: US PA Pittsburgh
- Agency: Dentons Cohen & Grigsby P.C.
- Main IPC: H05K3/12
- IPC: H05K3/12 ; H05K1/02 ; H01L23/498 ; H01Q1/36 ; H05K3/38 ; H01L21/48
Abstract:
A high-throughput method of manufacturing a liquid metal circuit may include applying a liquid metal to an alloying metal pattern on an elastic substrate to form the liquid metal circuit. The elastic substrate may have a surface area greater than 1 square inch. The liquid metal circuit may include a plurality of liquid metal circuits on the elastic substrate. Methods of using the liquid metal circuit are also described.
Public/Granted literature
- US20200296825A1 LIQUID METAL CIRCUITS AND METHODS OF MAKING THE SAME Public/Granted day:2020-09-17
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