Various aspects include devices, systems, and methods for cooling a heatsink of electronic equipment immersed in an immersion coolant tank with a coolant shroud. The coolant shroud includes side walls and a covering wall. The side walls mounted on a mounting surface within the immersion coolant tank and on which the heatsink is secured and at least one of the side walls includes a fluid port. The covering wall extends from and between the side walls, wherein the side walls and the covering wall together form a cooling chamber that receives the heatsink. The covering wall includes a fluid aperture separate from the fluid port, wherein dielectric fluid inside the cooling chamber is in fluid communication with dielectric fluid outside the cooling chamber via the fluid aperture. The fluid port is in fluid communication with a dielectric fluid pump disposed outside the cooling chamber.