Invention Grant
- Patent Title: Bottom electrode via structures for micromachined ultrasonic transducer devices
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Application No.: US17953155Application Date: 2022-09-26
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Publication No.: US11806747B2Publication Date: 2023-11-07
- Inventor: Lingyun Miao , Jianwei Liu
- Applicant: BFLY OPERATIONS, INC.
- Applicant Address: US CT Guilford
- Assignee: BFLY OPERATIONS, INC.
- Current Assignee: BFLY OPERATIONS, INC.
- Current Assignee Address: US MA Burlington
- Agency: Osha Bergman Watanabe & Burton LLP
- Main IPC: B06B1/02
- IPC: B06B1/02 ; B81B3/00 ; B81C1/00
Abstract:
An ultrasound transducer device includes an electrode, a membrane, and vias. The membrane is separated from the electrode by a cavity between the membrane and the electrode. The vias electrically connect the electrode to a substrate disposed on an opposite side of the electrode from a side facing the membrane. The vias are disposed in the ultrasound transducer device such that greater than 50% of the vias overlap with the cavity in a plan view.
Public/Granted literature
- US20230017034A1 BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSDUCER DEVICES Public/Granted day:2023-01-19
Information query
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