Invention Grant
- Patent Title: Processing device and processing method
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Application No.: US16631056Application Date: 2017-11-07
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Publication No.: US11806794B2Publication Date: 2023-11-07
- Inventor: Jun Eto , Hirokazu Unno , Shinichi Takeuchi
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- International Application: PCT/JP2017/040165 2017.11.07
- International Announcement: WO2019/092797A 2019.05.16
- Date entered country: 2020-01-14
- Main IPC: B23C3/13
- IPC: B23C3/13 ; B23Q3/08 ; B23Q7/04 ; B23Q7/14 ; B23Q41/02 ; G05B19/401 ; B23Q3/06 ; B23Q3/10 ; B23Q1/00 ; B23C3/00

Abstract:
A processing device includes: a first processing position (A1) and a second processing position (A2) at which rough processing is performed on a workpiece (W); a third processing position (B1) at which final finishing processing is performed on the workpiece (W) that was processed at the second processing position (A2); flexible vises (7) provided to the first processing position (A1) and the second processing position (A2), the flexible vises (7) securing the workpiece (W) by clamping the same; and a quick clamping device (20) provided to the third processing position (B1), the quick clamping device (20) securing the workpiece (W) by means of a pin. The processing device also includes a control unit that controls a rough processing tool for performing rough processing and a final finishing processing tool for performing final finishing processing.
Public/Granted literature
- US20200147703A1 PROCESSING DEVICE AND PROCESSING METHOD Public/Granted day:2020-05-14
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