Invention Grant
- Patent Title: Workpiece cutting method
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Application No.: US16614882Application Date: 2018-05-17
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Publication No.: US11806805B2Publication Date: 2023-11-07
- Inventor: Mikiharu Kuchiki , Hidefumi Kinda , Daisuke Kurita , Takeshi Sakamoto , Takafumi Ogiwara , Yuta Kondoh , Naoki Uchiyama
- Applicant: Kyoritsu Chemical & Co., Ltd. , HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Tokyo
- Assignee: Kyoritsu Chemical & Co., Ltd.,HAMAMATSU PHOTONICS K.K.
- Current Assignee: Kyoritsu Chemical & Co., Ltd.,HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Tokyo; JP Hamamatsu
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: JP 17102743 2017.05.24
- International Application: PCT/JP2018/019171 2018.05.17
- International Announcement: WO2018/216600A 2018.11.29
- Date entered country: 2019-11-19
- Main IPC: B23K26/16
- IPC: B23K26/16 ; B23K26/40 ; H01L21/50 ; H01L21/67 ; H01L21/78 ; B23K101/40 ; B23K26/53

Abstract:
A object cutting method includes a first step of attaching an expandable sheet to a front surface or a back surface of a object, a second step of irradiating the object with a laser light along a line to cut to form a modified region, and expanding the expandable sheet to divide at least a part of the object into a plurality of chips and to form a gap that exists between the chips and extends to a side surface crossing the front surface and the back surface of the object, a third step of, after the second step, filling the gap with a resin from an outer edge portion including the side surface of the object, a fourth step of, after the third step, curing and shrinking the resin, and a fifth step of, after the fourth step, taking out the chips from the expandable sheet.
Public/Granted literature
- US20200180075A1 WORKPIECE CUTTING METHOD Public/Granted day:2020-06-11
Information query
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