An apparatus for automated mold polishing is disclosed. In an embodiment, the apparatus comprises at least a processor and a memory communicatively connected to the processor. The memory containing instructions configuring the at least a processor to receive a finish assignment for at least a surface of a part for manufacture. The processor then determines a polish strategy for the at least a surface as a function of a geometry of the at least a surface. A polishing tool may then be selected for the at least a surface as a function of the finish assignment and the polish strategy for the at least a surface. A reachable area is then determined of the at least a surface as a function of the polishing tool. The processor then generates a toolpath as a function of the reachable area.