Invention Grant
- Patent Title: Nozzle arrangements
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Application No.: US18127619Application Date: 2023-03-28
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Publication No.: US11807005B2Publication Date: 2023-11-07
- Inventor: Galen Cook , Garrett E. Clark , Michael W. Cumbie , James R. Przybyla , Richard Seaver , Frank D. Derryberry , Si-Lam J. Choy
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Foley & Lardner LLP
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/145

Abstract:
In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.
Public/Granted literature
- US20230234355A1 NOZZLE ARRANGEMENTS Public/Granted day:2023-07-27
Information query
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