Invention Grant
- Patent Title: Mounting structure of thermal management module for vehicle
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Application No.: US17544348Application Date: 2021-12-07
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Publication No.: US11807070B2Publication Date: 2023-11-07
- Inventor: Yeonho Kim , Jeawan Kim , Jae Yeon Kim , Jung Bum Choi , Seong Woo Jeong , In guk Hwang
- Applicant: HYUNDAI MOTOR COMPANY , Kia Corporation , HANON SYSTEMS
- Applicant Address: KR Seoul
- Assignee: HYUNDAI MOTOR COMPANY,KIA CORPORATION,HANON SYSTEMS
- Current Assignee: HYUNDAI MOTOR COMPANY,KIA CORPORATION,HANON SYSTEMS
- Current Assignee Address: KR Seoul; KR Seoul; KR Daejeon
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20210080011 2021.06.21
- Main IPC: B60H1/00
- IPC: B60H1/00

Abstract:
A mounting structure of a thermal management module for a vehicle according to an embodiment of the present disclosure includes: front side members extending along a length direction of a vehicle and disposed on left and right sides of the vehicle, respectively, in a width direction of the vehicle; a dash reinforcement crossmember extending along the width direction of the vehicle and coupled to rear ends of the front side members on the left and right sides based on a front and rear direction of the vehicle; a crossmember dividing a space formed by the front side members into two spaces in the front and rear direction of the vehicle; and at least one mounting bracket, on which the thermal management module is mounted, configured to mount the thermal management module in one of the two spaces divided by the crossmember.
Public/Granted literature
- US20220402328A1 MOUNTING STRUCTURE OF THERMAL MANAGEMENT MODULE FOR VEHICLE Public/Granted day:2022-12-22
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