Invention Grant
- Patent Title: Vehicle mounted module support system
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Application No.: US17696430Application Date: 2022-03-16
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Publication No.: US11807193B2Publication Date: 2023-11-07
- Inventor: Taiga Marukawa , Gilberto Larrache-Irizarry , Douglas M. Dafler , Patrick J. Ellison , Kosaku Tomozawa , Keiichiro Tsuji , Anthony John Leanza , Takashi Nakano
- Applicant: Honda Motor Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: RANKIN, HILL & CLARK LLP
- Agent Mark E. Duell
- Main IPC: B60R11/00
- IPC: B60R11/00 ; B60R9/00

Abstract:
A module support system for a vehicle including exterior paneling defining an interior and exterior of the vehicle, and a frame disposed in the interior of the vehicle, the module support system including a first casting mounted on the frame, where the first casting extends outward from the frame, through the exterior paneling, to the exterior of the vehicle such that the first casting includes an interior portion disposed within the interior of the vehicle and mounted on the frame, and an exterior portion extending outward from the exterior of the vehicle. The module support system includes a first electronic device supported on the exterior portion of the first casting, and a cover fixed with the exterior portion of the first casting such that the cover is disposed over the first electronic device and the exterior portion of the first casting with respect to an external environment.
Public/Granted literature
- US20230294612A1 VEHICLE MOUNTED MODULE SUPPORT SYSTEM Public/Granted day:2023-09-21
Information query