Invention Grant
- Patent Title: Three-dimensional features formed in molded panel
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Application No.: US17482309Application Date: 2021-09-22
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Publication No.: US11807523B2Publication Date: 2023-11-07
- Inventor: Chien-Hua Chen , Devin A. Mourey , Michael G. Groh
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Foley & Lardner LLP
- The original application number of the division: US15761192
- Main IPC: B41J2/155
- IPC: B41J2/155 ; B41J2/16 ; B81C99/00 ; B81C1/00 ; B01L3/02
Abstract:
Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.
Public/Granted literature
- US20220002149A1 THREE-DIMENSIONAL FEATURES FORMED IN MOLDED PANEL Public/Granted day:2022-01-06
Information query
IPC分类:
