Invention Grant
- Patent Title: Thiol compounds, synthesis method therefor, and utilization of said thiol compounds
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Application No.: US16759089Application Date: 2018-10-25
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Publication No.: US11807596B2Publication Date: 2023-11-07
- Inventor: Naoto Okumura , Akihito Otsuka , Takeshi Kumano , Kazuyuki Fujikawa , Yusuke Araki
- Applicant: SHIKOKU CHEMICALS CORPORATION
- Applicant Address: JP Kagawa
- Assignee: SHIKOKU CHEMICALS CORPORATION
- Current Assignee: SHIKOKU CHEMICALS CORPORATION
- Current Assignee Address: JP Kagawa
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP 17206993 2017.10.26 JP 17213168 2017.11.02 JP 17213211 2017.11.02 JP 17213229 2017.11.02
- International Application: PCT/JP2018/039645 2018.10.25
- International Announcement: WO2019/082962A 2019.05.02
- Date entered country: 2020-04-24
- Main IPC: C07C321/22
- IPC: C07C321/22 ; C08L63/00 ; C09J163/00 ; C07C319/02 ; C07C319/18 ; C07D233/34 ; C07D235/26 ; C08G59/66 ; C07C321/14 ; C07C321/10
Abstract:
The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy compound; and resin compositions containing said thiol compounds and an ene compound having a carbon-carbon double bond in a molecule. Furthermore, the purpose of the present invention is to provide adhesives and sealants having these resin compositions as ingredients. The thiol compounds of the present invention are represented by chemical formula (I) to chemical formula (VII).
Public/Granted literature
- US20200369606A1 THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS Public/Granted day:2020-11-26
Information query
