Invention Grant
- Patent Title: Method for producing dicyclopentadiene-based resin
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Application No.: US16973509Application Date: 2019-05-14
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Publication No.: US11807696B2Publication Date: 2023-11-07
- Inventor: Hyeonuk Kang , Pilje Seong , Kyongjun Yoon , Min Ho Lee , Heejin Jang
- Applicant: HANWHA SOLUTIONS CORPORATION
- Applicant Address: KR Seoul
- Assignee: HANWHA SOLUTIONS CORPORATION
- Current Assignee: HANWHA SOLUTIONS CORPORATION
- Current Assignee Address: KR Seoul
- Agency: Harvest IP Law, LLP
- Priority: KR 20180066679 2018.06.11
- International Application: PCT/KR2019/005767 2019.05.14
- International Announcement: WO2019/240386A 2019.12.19
- Date entered country: 2020-12-09
- Main IPC: C08F2/01
- IPC: C08F2/01 ; C08F232/08

Abstract:
The present invention relates to a method for producing a dicyclopentadiene-based resin and a dicyclopentadiene-based resin produced thereby, the method comprising thermal polymerizing under non-catalyst, non-initiator conditions, thereby enabling not only excellent yield, but also, by a low polydispersity index, a narrow molecular weight distribution and the realization of uniform physical properties.
Public/Granted literature
- US20210246231A1 METHOD FOR PRODUCING DICYCLOPENTADIENE-BASED RESIN Public/Granted day:2021-08-12
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