Invention Grant
- Patent Title: UV-curable resins used for chemical mechanical polishing pads
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Application No.: US17503422Application Date: 2021-10-18
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Publication No.: US11807710B2Publication Date: 2023-11-07
- Inventor: Chen-Chih Tsai , Eric S. Moyer , Ping Huang
- Applicant: CMC Materials, Inc.
- Applicant Address: US IL Aurora
- Assignee: CMC Materials, Inc.
- Current Assignee: CMC Materials, Inc.
- Current Assignee Address: US IL Aurora
- Main IPC: C08G18/81
- IPC: C08G18/81 ; C08F2/48 ; C08G18/67 ; C08K3/04 ; C08G18/10 ; B24B37/24
Abstract:
The invention provides a UV-curable resin for forming a chemical-mechanical polishing pad comprising: (a) one or more acrylate blocked isocyanates; (b) one or more acrylate monomers; and (c) a photoinitiator. The invention also provides a method of forming a chemical-mechanical polishing pad using the UV-curable resin.
Public/Granted literature
- US20220119586A1 UV-CURABLE RESINS USED FOR CHEMICAL MECHANICAL POLISHING PADS Public/Granted day:2022-04-21
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