- Patent Title: Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing pattern cured product, method for producing interlayer insulating film, cover coat layer or surface protective film, and method for producing electronic component
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Application No.: US17043444Application Date: 2018-04-03
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Publication No.: US11807721B2Publication Date: 2023-11-07
- Inventor: Satoshi Yoneda , Tetsuya Enomoto
- Applicant: HD MICROSYSTEMS, LTD.
- Applicant Address: JP Tokyo
- Assignee: HD MICROSYSTEMS, LTD.
- Current Assignee: HD MICROSYSTEMS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: FITCH, EVEN, TABIN & FLANNERY, LLP
- International Application: PCT/JP2018/014273 2018.04.03
- International Announcement: WO2019/193647A 2019.10.10
- Date entered country: 2020-09-29
- Main IPC: G03F7/40
- IPC: G03F7/40 ; C08G73/12 ; C08F290/06 ; G03F7/028 ; G03F7/039 ; G03F7/038
Abstract:
A method for producing a polyimide precursor having a structural unit represented by the following formula (1),
comprising the following steps (i) and (ii), wherein at least one of the steps of (i) and (ii) is carried out in a solvent comprising a compound having an ether bond and an amide bond:
(i) a step of reacting carboxylic anhydride with a diamine compound to obtain a polyimide precursor having a structural unit represented by the following formula (2); and
(ii) a step of reacting the polyimide precursor having a structural unit represented by the formula (2) with a compound represented by the following formula (8), and reacting the reactant with a compound represented by the following formula (9) to obtain a polyimide precursor having a structural unit represented by the following formula (1):
wherein in the formula (1), at least one of R1 and R2 is a group represented by the formula (3):
comprising the following steps (i) and (ii), wherein at least one of the steps of (i) and (ii) is carried out in a solvent comprising a compound having an ether bond and an amide bond:
(i) a step of reacting carboxylic anhydride with a diamine compound to obtain a polyimide precursor having a structural unit represented by the following formula (2); and
(ii) a step of reacting the polyimide precursor having a structural unit represented by the formula (2) with a compound represented by the following formula (8), and reacting the reactant with a compound represented by the following formula (9) to obtain a polyimide precursor having a structural unit represented by the following formula (1):
wherein in the formula (1), at least one of R1 and R2 is a group represented by the formula (3):
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