Invention Grant
- Patent Title: Resin composition and molding method thereof
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Application No.: US16704226Application Date: 2019-12-05
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Publication No.: US11807751B2Publication Date: 2023-11-07
- Inventor: Seiji Morita , Jin Nasukawa , Kenichi Sato , Laksmi Kusumawardhani
- Applicant: Hemicellulose Ltd.
- Applicant Address: JP Kanagawa
- Assignee: Hemicellulose Ltd.
- Current Assignee: Hemicellulose Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Alix, Yale & Ristas, LLP
- Priority: JP 19030378 2019.02.22
- Main IPC: C08L5/14
- IPC: C08L5/14 ; B29C45/18 ; B29C45/56 ; B29C45/73 ; B29C45/74 ; C08L23/06 ; C08L23/12 ; C08L33/12 ; C08L67/02 ; C08L67/04 ; C08L69/00

Abstract:
A resin composition for molding having excellent heat resistance, hardness, cost-effectiveness and biodegradability is provided by using amorphous resin material components extracted from plant-derived wood. The resin composition includes a first resin including a hemicellulose or a hemicellulose derivative and a second resin including polymethylmethacrylate (PMMA, acrylic), polycarbonate (PC), cyclo olefin polymer (COP), cyclo olefin copolymer (COC), polypropylene (PP), polyethylene (PE), polyethylene terephthalate (PET), or polystyrene (PS) and has excellent injection moldability.
Public/Granted literature
- US20200270430A1 Resin Composition and Molding Method Thereof Public/Granted day:2020-08-27
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