- Patent Title: Semiconductor processing liquid and method for processing substrate
-
Application No.: US17181352Application Date: 2021-02-22
-
Publication No.: US11807792B2Publication Date: 2023-11-07
- Inventor: Takahiro Eto , Lihong Liu
- Applicant: TOKYO OHKA KOGYO CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: C09K13/04
- IPC: C09K13/04 ; H01L21/306 ; C09K13/06 ; H01L21/3213 ; C09K13/08 ; H01L21/311

Abstract:
A semiconductor processing liquid including hydrofluoric acid, and an organic solvent, in which the organic solvent contains a compound represented by the formula below in which X1 is a single bond or an alkylene group having 1 to 6 carbon atoms, in which an ether bond may be interposed, Y10 is one of —O—, —(C═O)—, —O—(C═O)—, and —(C═O)—O—, Y20 is one of —(C═O)—, —O—(C═O)—, and —(C═O)—O—, and Y11 and Y21 are each independently a single bond or an alkylene group having 1 to 6 carbon atoms in which an ether bond may be interposed, provided that, X1, Y11, and Y21 do not contain hydroxyl groups in structures thereof, and when X1 is a single bond, Y10 is not —O—)
H3C—Y11—Y10—X1—Y20—Y21—CH3 (1).
H3C—Y11—Y10—X1—Y20—Y21—CH3 (1).
Public/Granted literature
- US20210324271A1 SEMICONDUCTOR PROCESSING LIQUID AND METHOD FOR PROCESSING SUBSTRATE Public/Granted day:2021-10-21
Information query