Invention Grant
- Patent Title: Thermally conductive composition
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Application No.: US16305815Application Date: 2017-05-31
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Publication No.: US11807800B2Publication Date: 2023-11-07
- Inventor: Susumu Saito , Masatoshi Sasaki , Tateo Takashima
- Applicant: MITSUI CHEMICALS, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUI CHEMICALS, INC.
- Current Assignee: MITSUI CHEMICALS, INC.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP 16108848 2016.05.31 JP 16108849 2016.05.31 JP 16128262 2016.06.29 JP 16128263 2016.06.29 JP 17029779 2017.02.21 JP 17029780 2017.02.21 JP 17044638 2017.03.09 JP 17044639 2017.03.09
- International Application: PCT/JP2017/020356 2017.05.31
- International Announcement: WO2017/209215A 2017.12.07
- Date entered country: 2018-11-29
- Main IPC: C09K5/14
- IPC: C09K5/14 ; C08K3/22 ; C08L23/00 ; G04B37/22

Abstract:
Disclosed are a thermally conductive composition that contains 10 to 50 parts by mass of a thermoplastic resin (A) and 50 to 90 parts by mass of a metal oxide (B) such as magnesium oxide (a total of the thermoplastic resin (A) and the metal oxide (B) being 100 parts by mass), and a thermally conductive composition that contains a thermoplastic resin (A) and a metal oxide (B) such as magnesium oxide, in which a modified polyolefin-based wax (C) is further contained in an amount of 0.1 to 20 parts by mass with respect to 100 parts by mass of the thermoplastic resin (A), such thermally conductive compositions being useful for applications such as a container, a piece of tableware, a heat dissipating member, a water-circulating structure material, an electronic device casing, a timepiece exterior material, a tumbler, and a commodity for daily use.
Public/Granted literature
- US20210253926A1 THERMALLY CONDUCTIVE COMPOSITION Public/Granted day:2021-08-19
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