Invention Grant
- Patent Title: Copper alloy sliding material
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Application No.: US17639095Application Date: 2020-10-14
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Publication No.: US11807926B2Publication Date: 2023-11-07
- Inventor: Yuhei Ebata
- Applicant: TAIHO KOGYO CO., LTD.
- Applicant Address: JP Toyota
- Assignee: TAIHO KOGYO CO., LTD.
- Current Assignee: TAIHO KOGYO CO., LTD.
- Current Assignee Address: JP Toyota
- Agency: Sughrue Mion, PLLC
- Priority: JP 19189103 2019.10.16
- International Application: PCT/JP2020/038714 2020.10.14
- International Announcement: WO2021/075447A 2021.04.22
- Date entered country: 2022-02-28
- Main IPC: C22C9/02
- IPC: C22C9/02 ; C22C12/00 ; B22F1/00

Abstract:
[Object] To improve both abrasion resistance and seizure resistance.
[Solution] A copper alloy sliding material is configured, which contains 0.5 to 12.0 mass % of Sn, 2.0 to 8.0 mass % of Bi, and 1.0 to 5.0 vol % of an inorganic compound, the balance being Cu and inevitable impurities, wherein the inorganic compound includes a first inorganic compound having an average particle size of 0.5 to 3.0 μm and a second inorganic compound having an average particle size of 4.0 to 20.0 μm, and wherein a value obtained by dividing a volume fraction of the first inorganic compound by a volume fraction of the second inorganic compound is 0.1 to 1.0.
[Solution] A copper alloy sliding material is configured, which contains 0.5 to 12.0 mass % of Sn, 2.0 to 8.0 mass % of Bi, and 1.0 to 5.0 vol % of an inorganic compound, the balance being Cu and inevitable impurities, wherein the inorganic compound includes a first inorganic compound having an average particle size of 0.5 to 3.0 μm and a second inorganic compound having an average particle size of 4.0 to 20.0 μm, and wherein a value obtained by dividing a volume fraction of the first inorganic compound by a volume fraction of the second inorganic compound is 0.1 to 1.0.
Public/Granted literature
- US20220298603A1 COPPER ALLOY SLIDING MATERIAL Public/Granted day:2022-09-22
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