Invention Grant
- Patent Title: Ceiling panel attachment assembly
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Application No.: US17409342Application Date: 2021-08-23
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Publication No.: US11808038B2Publication Date: 2023-11-07
- Inventor: Marie A. DePaul
- Applicant: ARMSTRONG WORLD INDUSTRIES, INC.
- Applicant Address: US PA Lancaster
- Assignee: AWI Licensing LLC
- Current Assignee: AWI Licensing LLC
- Current Assignee Address: US DE Wilmington
- Agent Patrick Sheldrake
- Main IPC: E04B9/24
- IPC: E04B9/24 ; E04B9/04
Abstract:
Described herein is a method of installing a ceiling system comprising adhesively bonding together a ceiling panel and a magnetic attachment element to form a ceiling panel assembly, magnetically coupling the ceiling panel assembly to at least one suspended support element; and wherein the ceiling panel and the magnetic attachment element are adhesively bonded together a the time of installation.
Public/Granted literature
- US20220056689A1 CEILING PANEL ATTACHMENT ASSEMBLY Public/Granted day:2022-02-24
Information query
