Invention Grant
- Patent Title: Heat pump water heater systems and methods for low ambient temperature conditions
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Application No.: US17510642Application Date: 2021-10-26
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Publication No.: US11808494B2Publication Date: 2023-11-07
- Inventor: Yang Zou , Sivakumar Gopalnarayanan
- Applicant: Rheem Manufacturing Company
- Applicant Address: US GA Atlanta
- Assignee: Rheem Manufacturing Company
- Current Assignee: Rheem Manufacturing Company
- Current Assignee Address: US GA Atlanta
- Agency: Eversheds Sutherland (US) LLP
- Main IPC: F25B30/02
- IPC: F25B30/02 ; F25B39/00 ; F25B49/02

Abstract:
The disclosed technology includes devices, systems, and methods for heat pump systems configured to operate in low ambient temperatures. The disclosed technology can include a heat pump water heater system having an evaporator, a first compressor configured to compress refrigerant to a first pressure, and a second compressor configured to compress the refrigerant to a second pressure. The second pressure can be greater than the first pressure. The heat pump water heater system can include a preheater configured to receive the refrigerant at the first pressure and heat water and a condenser configured to receive the refrigerant at the second pressure and heat water. The water can be passed through the preheater before being passed through the condenser.
Public/Granted literature
- US20230129242A1 HEAT PUMP WATER HEATER SYSTEMS AND METHODS FOR LOW AMBIENT TEMPERATURE CONDITIONS Public/Granted day:2023-04-27
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