Invention Grant
- Patent Title: Loop heat pipe
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Application No.: US17193117Application Date: 2021-03-05
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Publication No.: US11808521B2Publication Date: 2023-11-07
- Inventor: Yoshihiro Machida
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano
- Agency: IPUSA, PLLC
- Priority: JP 20046252 2020.03.17
- Main IPC: F28D15/04
- IPC: F28D15/04

Abstract:
A loop heat pipe includes two outermost metal layers, an intermediate metal layer provided between the outermost metal layers, an evaporator, a condenser, and liquid and vapor pipes connecting the evaporator and the condenser and forming a loop shaped passage. The intermediate metal layer includes a pair of walls forming a part of a pipe wall of the evaporator, the condenser, the liquid pipe, and the vapor pipe, a porous body provided between the pair of walls, and a strut penetrating the porous body and bonding the outermost metal layers, and one or more metal layers. Each of the one or more metal layers includes a first part forming a part of the pair of walls, a second part connected to the first part and forming a part of the porous body, and a third part connected to the second part and forming a part of the strut.
Public/Granted literature
- US20210293487A1 LOOP HEAT PIPE Public/Granted day:2021-09-23
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