Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method to suppress alteration of processing liquid
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Application No.: US17749530Application Date: 2022-05-20
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Publication No.: US11808696B2Publication Date: 2023-11-07
- Inventor: Noboru Matsuyama
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Venjuris, P.C.
- Priority: JP 17253703 2017.12.28
- Main IPC: G01N21/31
- IPC: G01N21/31 ; G01N21/27 ; G03F7/20 ; G01N21/25 ; G01N21/85 ; H01L21/67 ; G03F7/16

Abstract:
A coating/developing device includes: a first laser unit that irradiates a coating liquid with laser light and acquires a state of the coating liquid based on a change in the laser light; and an irradiation propriety determination mechanism that determines whether the first laser unit irradiates the coating liquid with the laser light based on the coating liquid on a liquid bottle side of a position where the laser light is irradiated from the first laser unit in a flow path. The irradiation propriety determination mechanism includes: a second laser unit that acquires color information of the coating liquid; and a controller. The controller determines whether the color information of the coating liquid is predetermined color information that readily absorbs a wavelength of the light irradiated by the first laser unit and executes determining whether to irradiate the coating liquid with the laser light based on the determination result.
Public/Granted literature
- US20220276155A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND COMPUTER-READABLE RECORDING MEDIUM Public/Granted day:2022-09-01
Information query
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