A method for testing at least one single chip in a wafer probing system, at least comprising: providing an adapter plate having an interface surface for contacting a vacuum chuck of the wafer probing system, the adapter plate being configured to accommodate the at least one single chip in a cutout with a chip rear surface being flush with the interface surface; loading the adapter plate with the at least one single chip into the wafer probing system; determining an exact position of the at least one single chip in the adapter plate in the search area; and testing the at least one single chip with test routines stored in a controller of the wafer probing system. A device and an adapter plate for testing at least one single chip in a wafer probing system.