Invention Grant
- Patent Title: Semiconductor structure and fabrication method thereof
-
Application No.: US17646125Application Date: 2021-12-27
-
Publication No.: US11808975B2Publication Date: 2023-11-07
- Inventor: Jun Liu , Hong Gang Dai , Dong Xiang Cheng
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN Shanghai; CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN 2011587896.X 2020.12.28
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/10 ; G02B6/122 ; G02B6/136

Abstract:
A semiconductor structure and a fabrication method are provided. The semiconductor structure includes: a base substrate, an optical waveguide layer over the base substrate; a first dielectric layer over the base substrate; a cavity between the first dielectric layer and the optical waveguide layer; and a second dielectric layer on the first dielectric layer and the optical waveguide layer. The cavity is located on sidewall surfaces of the optical waveguide layer and has a bottom coplanar with a bottom of the optical waveguide layer. The second dielectric layer is located on a top of the cavity and seals the cavity.
Public/Granted literature
- US20220206217A1 SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF Public/Granted day:2022-06-30
Information query