Invention Grant
- Patent Title: Photonic integrated circuit and package structure
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Application No.: US17206130Application Date: 2021-03-19
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Publication No.: US11809000B2Publication Date: 2023-11-07
- Inventor: Tsung-Yuan Yu , Hung-Yi Kuo , Cheng-Chieh Hsieh , Hao-Yi Tsai , Chung-Ming Weng , Hua-Kuei Lin , Che-Hsiang Hsu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/42 ; H01L23/00 ; H01L25/16

Abstract:
A photonic integrated circuit includes a substrate, an interconnection layer, and a plurality of silicon waveguides. The interconnection layer is over the substrate. The interconnection layer includes a seal ring structure and an interconnection structure surrounded by the seal ring structure. The seal ring structure has at least one recess from a top view. The recess concaves towards the interconnection structure. The silicon waveguides are embedded in the substrate.
Public/Granted literature
- US20220299719A1 PHOTONIC INTEGRATED CIRCUIT AND PACKAGE STRUCTURE Public/Granted day:2022-09-22
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