Invention Grant
- Patent Title: Photoresist compositions and pattern formation methods
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Application No.: US17198749Application Date: 2021-03-11
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Publication No.: US11809077B2Publication Date: 2023-11-07
- Inventor: Thomas Cardolaccia , Jason A. DeSisto , Choong-Bong Lee , Mingqi Li , Tomas Marangoni , Chunyi Wu , Cong Liu , Gregory P. Prokopowicz
- Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Applicant Address: US MA Marlborough
- Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Current Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Current Assignee Address: US MA Marlborough
- Agency: CANTOR COLBURN LLP
- Main IPC: G03F7/004
- IPC: G03F7/004 ; C08F220/28 ; C08F220/18 ; G03F7/027
Abstract:
A photoresist composition comprises a first polymer formed by free radical polymerization. The first polymer comprises polymerized units formed from a monomer that comprises an ethylenically unsaturated double bond and an acid-labile group; a photoacid generator; a quencher of formula (1):
and a solvent.
and a solvent.
Information query
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