Invention Grant
- Patent Title: Multistage micromechanical timepiece and method for making same
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Application No.: US16486747Application Date: 2018-02-07
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Publication No.: US11809136B2Publication Date: 2023-11-07
- Inventor: Michel Despont , Philippe Niedermann
- Applicant: CSEM Centre Suisse d'Electronique et de Microtechnique SA—Recherche et Développment
- Applicant Address: CH Neuchâtel
- Assignee: CSEM Centre Suisse d'Electronique et de Microtechnique SA—Recherche et Développment
- Current Assignee: CSEM Centre Suisse d'Electronique et de Microtechnique SA—Recherche et Développment
- Current Assignee Address: CH Neuchâtel
- Agency: Patterson Thuente, P.A.
- Priority: CH 20517 2017.02.22
- International Application: PCT/EP2018/052999 2018.02.07
- International Announcement: WO2018/153664A 2018.08.30
- Date entered country: 2019-10-25
- Main IPC: G04B17/06
- IPC: G04B17/06 ; G04B29/02 ; G04D3/00 ; B81B3/00 ; B81C1/00 ; B81B5/00

Abstract:
A micromechanical timepiece, and a method for making the same, having a plurality of mutually secured functional sub-assemblies stacked in a direction (Z) to form a multistage assembly, wherein each functional sub-assembly comprises a single semiconductor material and is secured to another sub-assembly via bridges made of the semiconductor material, and in that at least one sub-assembly comprises at least two portions, the portions being movable relative to each other and relative to another sub-assembly to which at least one of the portions is secured via at least one deformable link integrally formed between the portions.
Public/Granted literature
- US20200050150A1 MULTISTAGE MICROMECHANICAL TIMEPIECE AND METHOD FOR MAKING SAME Public/Granted day:2020-02-13
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