Invention Grant
- Patent Title: Housing and device
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Application No.: US17118808Application Date: 2020-12-11
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Publication No.: US11809140B2Publication Date: 2023-11-07
- Inventor: Koki Takasawa
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP 19225201 2019.12.13
- Main IPC: C23C8/00
- IPC: C23C8/00 ; G04B37/22 ; C23C28/00 ; C23C8/26 ; C21D6/00 ; C21D9/00

Abstract:
A housing is a housing formed of austenitized ferritic stainless steel including a base formed of a ferrite phase and a surfacing layer formed of an austenitized phase in which the ferrite phase is austenitized, the housing including a first surface exposed to an external space of the housing, and a second surface adjacent to the first surface with a corner portion interposed therebetween, and exposed to the external space, wherein an angle of an internal angle formed by the first surface and the second surface at the corner portion is greater than 0°, and less than 180°, and a surfacing layer at the corner portion is thicker in thickness than a surfacing layer in the first surface and a surfacing layer in the second surface.
Public/Granted literature
- US20210181685A1 Housing And Device Public/Granted day:2021-06-17
Information query
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