An electronic hinge system is provided, including a first component and a second component. The first component may include a first enclosure, a first substrate extending within the first enclosure, a first connector, and a plurality of curved elements disposed in the first connector. The first substrate may have electrically conductive elements and microelectronic devices electrically connected with the electrically conductive elements. The curved elements may be electrically conductive and spaced apart from one another. Each curved element may be electrically connected with a respective one of the electrically conductive elements of the first component. The second component may include a second enclosure and a second connector disposed at an end of the second enclosure. The first connector may be configured to mate with the second connector, such that when the first component is engaged with the second component, the first connector is rotationally coupled with the second connector.