Invention Grant
- Patent Title: Wafer-level package assembly handling
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Application No.: US16651870Application Date: 2018-09-28
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Publication No.: US11809441B2Publication Date: 2023-11-07
- Inventor: Kevin Barr , Edward Andrew Condon
- Applicant: Onto Innovation, Inc.
- Applicant Address: US DE Wilmington
- Assignee: Onto Innovation Inc.
- Current Assignee: Onto Innovation Inc.
- Current Assignee Address: US MA Wilmington
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/US2018/053300 2018.09.28
- International Announcement: WO2019/067834A 2019.04.04
- Date entered country: 2020-03-27
- Main IPC: G06F16/25
- IPC: G06F16/25 ; G06F16/26 ; G06F16/176 ; G06F16/28 ; H01L21/683 ; H01L21/687 ; H01L21/66
Abstract:
A chuck assembly includes an upper surface configured to support a wafer-level package assembly and a clamping mechanism securing the wafer-level package assembly to the upper surface.
Public/Granted literature
- US20220121676A2 WAFER-LEVEL PACKAGE ASSEMBLY HANDLING Public/Granted day:2022-04-21
Information query
