Invention Grant
- Patent Title: Implementing large multipliers in tensor arrays
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Application No.: US16914018Application Date: 2020-06-26
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Publication No.: US11809798B2Publication Date: 2023-11-07
- Inventor: Martin Langhammer , Simon Peter Finn
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Fletcher Yoder, P.C.
- Main IPC: G06F30/34
- IPC: G06F30/34 ; G06N20/00 ; G06F9/30 ; G06F9/54

Abstract:
The present disclosure describes an integrated circuit device that includes a digital signal processing (DSP) block. The DSP block that includes a plurality of columns of weight registers and a plurality of inputs configured to receive a first plurality of values and a second plurality of values. The first plurality of values is stored in the plurality of columns of weight registers after being received. Also, the first plurality of inputs, the second plurality of inputs, or both are derived from higher precision values. Additionally, the DSP block includes a plurality of multipliers configured to simultaneously multiply each value of the first plurality of values by each value of the second plurality of values.
Public/Granted literature
- US20210182465A1 Implementing Large Multipliers in Tensor Arrays Public/Granted day:2021-06-17
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