Invention Grant
- Patent Title: Interface for data communication between chiplets or other integrated circuits on an interposer
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Application No.: US17958343Application Date: 2022-10-01
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Publication No.: US11809800B2Publication Date: 2023-11-07
- Inventor: Tony M. Brewer
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Gamburd Law Group LLC
- Agent Nancy R. Gamburd
- Main IPC: G06F30/394
- IPC: G06F30/394 ; G11C7/10 ; G11C11/409 ; H04L69/18 ; H04L69/12 ; H04L9/40

Abstract:
A representative system, apparatus, method and protocol are disclosed for data communication between chiplets or SOCs on a common interposer. A representative system comprises: an interposer; a first integrated circuit arranged on the interposer, the first integrated circuit comprising a first common protocol interface circuit; a communication link coupled to the first common protocol interface circuit; and a second integrated circuit arranged on the interposer, the second integrated circuit comprising a second common protocol interface circuit coupled to the communication link to form a serial protocol interface between the first common protocol interface circuit and the second common protocol interface circuit. Serial data and control packets and parallel data and control packets having specified, ordered fields are also disclosed.
Public/Granted literature
- US20230042222A1 Interface for Data Communication Between Chiplets or other Integrated Circuits on an Interposer Public/Granted day:2023-02-09
Information query