Invention Grant
- Patent Title: Embedded vertical inductor in laminate stacked substrates
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Application No.: US16210594Application Date: 2018-12-05
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Publication No.: US11817239B2Publication Date: 2023-11-14
- Inventor: Daniel Daeik Kim , Bonhoon Koo , Babak Nejati
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP
- Main IPC: H01F27/36
- IPC: H01F27/36 ; H01F17/00 ; H01F41/04 ; H04B1/40 ; H04B1/04

Abstract:
A vertical inductor structure includes a first laminate substrate forming a first portion of the vertical inductor structure and a second laminate substrate forming a second portion. Each laminate substrate includes a plurality of first traces embedded in a layer of the laminate substrate, a plurality of first vertical columns, and a plurality of second vertical columns. Each first vertical columns is coupled to a first end of a respective first trace, and each second vertical column is coupled to a second end of a respective first trace. The second laminate substrate is mounted on the first laminate substrate such that each first vertical column of the first laminate substrate is coupled to a respective first vertical column of the second laminate substrate, and each second vertical column of the first laminate substrate is coupled to a respective second vertical column of the second laminate substrate.
Public/Granted literature
- US20190189327A1 EMBEDDED VERTICAL INDUCTOR IN LAMINATE STACKED SUBSTRATES Public/Granted day:2019-06-20
Information query