Invention Grant
- Patent Title: Multi-layered ceramic electronic component
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Application No.: US17389803Application Date: 2021-07-30
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Publication No.: US11817259B2Publication Date: 2023-11-14
- Inventor: Je Jung Kim , Dong Yeong Kim , Woo Chul Shin , Ji Hong Jo
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20180160024 2018.12.12
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30 ; H01G4/248 ; H01G4/008 ; H01G4/012 ; H01G4/12

Abstract:
A multi-layered ceramic electronic component has a ceramic body including dielectric layers and a plurality of internal electrodes opposing each other with the dielectric layers interposed therebetween. External electrodes are disposed on an exterior of the ceramic body and are electrically connected to the internal electrodes. Each external electrode includes an electrode layer electrically connected to internal electrodes, and a conductive resin layer arranged on the electrode layer. The conductive resin layer extends to first and second surface of the ceramic body, and a ratio of a thickness (Tb) of the conductive resin layer extending onto the first surface and the second surface of the ceramic body to a length (Lm) of a length direction margin portion of the ceramic body satisfies 2 to 29%.
Public/Granted literature
- US20210358691A1 MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT Public/Granted day:2021-11-18
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