Invention Grant
- Patent Title: Method of manufacturing an electronic device and electronic device manufactured thereby
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Application No.: US17340776Application Date: 2021-06-07
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Publication No.: US11823913B2Publication Date: 2023-11-21
- Inventor: Bora Baloglu , Curtis Zwenger , Ronald Huemoeller
- Applicant: Amkor Technology Singapore Holding Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
- Current Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/683 ; H01L23/00 ; H01L23/31 ; H01L23/498
Abstract:
An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide methods of making an electronic device, and electronic devices made thereby, that comprise forming first and second encapsulating materials, followed by further processing and the removal of the entire second encapsulating material.
Information query
IPC分类:
